Name：Process capability Model：Process capability Details： Num Item Technical capability     Standard 1 Number of Layers Rigid PCB 1-16 layer 2 Maximum board size   550mm*550 mm 3 Laminate   FR4,FR-1, CEM-3, High TG, Aluminum base, 4 Board thickness thickness 0.20-4.0 mm Tolerance +/-8% 5 Minimum track width   4 mil 6 Minimum track gap   4 mil 7 copper thickness Outer layer H oz ---12 oz Inner layer H oz ---6 oz 8 Hole specication Max. PTH/NPTH size PTH:6.35MM NPTH: 6.35MM Min.hole size PTH : 0.1MM NPTH : 0.2MM Tolerance +/-0.075MM 9 Aspect ratio   13:1 10 Surface Treatment (thickness) Flash Gold gold : 1-2u" ni: 100--200u" Immersion Gold gold : 1-3u" ni: 100--250u" Sn/PB HASL 1---40um Leadfree HASL 1---40um Immersion Silver 0.1----0.4um OSP (Entek) 0.2---0.5um Gold Finger >=30u" Immersion Sn 0.8--1.2um 11 Plug via hole Min. size 0.2mm Max. size 1.0mm 12 S/M pitch(IC to IC)   18mil 13 Outline Profile Routing +/-0.1mm punching +/-0.1mm V-Cut +/-0.1mm 14 Impedance Control   +/-10% 15 Wrap and Twist   <=0.75% 16 special tech   Peelable mask, Carbon ink, Capton tape